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an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. tlv703 sbvs305 ? march 2017 tlv703 300-ma, low-i q , low-dropout regulator 1 1 features 1 ? very low dropout: ? 37 mv at i out = 50 ma, v out = 2.8 v ? 75 mv at i out = 100 ma, v out = 2.8 v ? 220 mv at i out = 300 ma, v out = 2.8 v ? 2% accuracy ? low i q : 35 a ? fixed-output voltage combinations possible from 1.2 v to 4.8 v ? high psrr: 68 db at 1 khz ? stable with effective capacitance of 0.1 f ? thermal shutdown and overcurrent protection ? packages: 5-pin sot-23 2 applications ? wireless handsets ? smart phones ? zigbee ? networks ? bluetooth ? devices ? li-ion battery-operated handheld products ? wlan and other pc add-on cards 3 description the tlv703 series of low-dropout (ldo) linear regulators are low quiescent current devices with excellent line and load transient performance. these ldos are designed for power-sensitive applications. a precision band-gap and error amplifier provides overall 2% accuracy. low output noise, very high power-supply rejection ratio (psrr), and low-dropout voltage make this series of devices ideal for a wide selection of battery-operated handheld equipment. all device versions have thermal shutdown and current limit for safety. furthermore, these devices are stable with an effective output capacitance of only 0.1 f. this feature enables the use of cost-effective capacitors that have higher bias voltages and temperature derating. the devices regulate to specified accuracy with no output load. the tlv703 series of ldo linear regulators are available in a 5-pin sot-23 package. device information (1) part number package body size (nom) tlv703 sot-23 (5) 2.90 mm 1.60 mm (1) for all available packages, see the orderable addendum at the end of the data sheet. space space space space typical application circuit productfolder tlv703 in en out gnd c out c in on off support &community tools & software technical documents ordernow
2 tlv703 sbvs305 ? march 2017 www.ti.com product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 pin configuration and functions ......................... 3 6 specifications ......................................................... 4 6.1 absolute maximum ratings ...................................... 4 6.2 esd ratings ............................................................ 4 6.3 recommended operating conditions ....................... 4 6.4 thermal information .................................................. 4 6.5 electrical characteristics ........................................... 5 6.6 typical characteristics .............................................. 6 7 detailed description ............................................ 10 7.1 overview ................................................................. 10 7.2 functional block diagram ....................................... 10 7.3 feature description ................................................. 10 7.4 device functional modes ........................................ 11 8 application and implementation ........................ 12 8.1 application information ............................................ 12 8.2 typical application .................................................. 12 9 power supply recommendations ...................... 13 9.1 power dissipation ................................................... 13 10 layout ................................................................... 14 10.1 layout guidelines ................................................. 14 10.2 layout example .................................................... 14 10.3 thermal consideration .......................................... 14 11 device and documentation support ................. 15 11.1 device support .................................................... 15 11.2 documentation support ........................................ 15 11.3 receiving notification of documentation updates 15 11.4 community resources .......................................... 15 11.5 trademarks ........................................................... 15 11.6 electrostatic discharge caution ............................ 15 11.7 glossary ................................................................ 15 12 mechanical, packaging, and orderable information ........................................................... 16 4 revision history note: page numbers for previous revisions may differ from page numbers in the current version. date revision notes march 2017 * initial release.
3 tlv703 www.ti.com sbvs305 ? march 2017 product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated 5 pin configuration and functions dbv package 5-pin sot-23 top view pin functions pin i/o description no. name 1 in i input pin. a small, 1- f ceramic capacitor is recommended from this pin to ground to assure stability and good transient performance. see the input and output capacitor requirements in the application information section for more details. 2 gnd ? ground pin 3 en i enable pin. driving en over 0.9 v turns on the regulator. driving en below 0.4 v puts the regulator into shutdown mode and reduces operating current to 1 a, nominal. 4 nc ? no connection. this pin can be tied to ground to improve thermal dissipation. 5 out o regulated output voltage pin. a small, 1- f ceramic capacitor is needed from this pin to ground to assure stability. see the input and output capacitor requirements in the application information section for more details. 1 in 2 gnd 3 en 4 nc 5 out not to scale
4 tlv703 sbvs305 ? march 2017 www.ti.com product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. (2) all voltages are with respect to the network ground terminal. 6 specifications 6.1 absolute maximum ratings over operating junction temperature range (unless otherwise noted) (1) min max unit voltage (2) in, en, out ? 0.3 6 v current (source) out internally limited output short-circuit duration indefinite total continuous power dissipation see thermal information temperature operating virtual junction, t j ? 55 150 c storage, t stg ? 55 150 (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (2) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 6.2 esd ratings value unit v (esd) electrostatic discharge human body model (hbm), per ansi/esda/jedec js-001 (1) 2000 v charged device model (cdm), per jedec specification jesd22-c101 (2) 500 6.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) min nom max unit v in input voltage range 2 5.5 v v out output voltage range 1.2 4.8 v i out output current 0 300 ma (1) for more information about traditional and new thermal metrics, see the semiconductor and ic package thermal metrics application report. 6.4 thermal information thermal metric (1) tlv703 unit dbv (sot-23) 5 pins r ja junction-to-ambient thermal resistance 254.1 c/w r jc(top) junction-to-case (top) thermal resistance 143.9 c/w r jb junction-to-board thermal resistance 58.0 c/w jt junction-to-top characterization parameter 25.3 c/w jb junction-to-board characterization parameter 56.6 c/w r jc(bot) junction-to-case (bottom) thermal resistance n/a c/w
5 tlv703 www.ti.com sbvs305 ? march 2017 product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated (1) v do is measured for devices with v out(nom) 2.35 v. (2) start-up time = time from en assertion to 0.98 v out(nom) . 6.5 electrical characteristics at v in = v out(nom) + 0.5 v or 2 v (whichever is greater), i out = 10 ma, v en = 0.9 v, c out = 1 f, and t j = ? 40 c to +125 c (unless otherwise noted); typical values are at t j = 25 c parameter test conditions min typ max unit v in input voltage range 2 5.5 v v out dc output accuracy ? 40 c t j 125 c ? 2% 0.5% 2% v out( vin) line regulation v out(nom) + 0.5 v v in 5.5 v, i out = 10 ma 1 5 mv v out( iout) load regulation 0 ma i out 300 ma 1 15 mv v do dropout voltage (1) v in = 0.98 v out(nom) , i out = 300 ma 260 375 mv i cl output current limit v out = 0.9 v out(nom) 320 500 860 ma i gnd ground pin current i out = 0 ma 35 55 a i out = 300 ma, v in = v out + 0.5 v 370 i shdn ground pin current (shutdown) v en 0.4 v, v in = 2 v 400 na v en 0.4 v, 2 v v in 4.5 v, t j = ? 40 c to +85 c 1 2 a psrr power-supply rejection ratio v in = 2.3 v, v out = 1.8 v, i out = 10 ma, f = 1 khz 68 db v n output noise voltage bw = 100 hz to 100 khz, v in = 2.3 v, v out = 1.8 v, i out = 10 ma 48 v rms t str start-up time (2) c out = 1 f, i out = 300 ma 100 s v en(high) enable pin high (enabled) 0.9 v in v v en(low) enable pin low (disabled) 0 0.4 v i en enable pin current v in = v en = 5.5 v 0.04 a uvlo undervoltage lockout v in rising 1.9 v t sd thermal shutdown temperature shutdown, temperature increasing 165 c reset, temperature decreasing 145 t j operating junction temperature ? 40 125 c
6 tlv703 sbvs305 ? march 2017 www.ti.com product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated 6.6 typical characteristics over operating temperature range (t j = ? 40 c to +125 c), v in = v out(nom) + 0.5 v or 2 v, whichever is greater, i out = 10 ma, v en = v in , c out = 1 f (unless otherwise noted); typical values are at t j = 25 c v out = 1.8 v, i out = 10 ma figure 1. line regulation v out = 1.8 v, i out = 300 ma figure 2. line regulation v out = 1.8 v figure 3. load regulation i out = 300 ma figure 4. dropout voltage vs input voltage v out = 1.8 v figure 5. output voltage vs temperature v out = 1.8 v figure 6. ground pin current vs input voltage 1.901.88 1.86 1.84 1.82 1.80 1.78 1.76 1.74 1.72 1.70 v (v) out 2.3 2.7 3.1 3.5 3.9 4.3 4.7 v (v) in 5.5 5.1 +125c+85c +25c -40c 350300 250 200 150 100 50 0 v (mv) do 2.25 2.75 3.25 3.75 4.25 4.75 v (v) in +125 c +85 c +25 c C40 c 1.901.88 1.86 1.84 1.82 1.80 1.78 1.76 1.74 1.72 1.70 v (v) out 2.1 2.6 3.1 3.6 4.1 4.6 5.1 v (v) in 5.6 +125c+85c +25c -40c 5045 40 35 30 25 20 15 10 50 i (ma) gnd 2.1 2.6 3.1 3.6 4.1 4.6 5.1 v (v) in 5.6 +125c+85c +25c -40c 0 100 150 300 i (ma) out 1.901.88 1.86 1.84 1.82 1.80 1.78 1.76 1.74 1.72 1.70 v (v) out 50 200 +125c+85c +25c -40c 250 1.901.88 1.86 1.84 1.82 1.80 1.78 1.76 1.74 1.72 1.70 v (v) out -40 -25 -10 5 20 35 50 65 80 95 110 temperature (c) 125 10ma150ma 200ma
7 tlv703 www.ti.com sbvs305 ? march 2017 product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated typical characteristics (continued) over operating temperature range (t j = ? 40 c to +125 c), v in = v out(nom) + 0.5 v or 2 v, whichever is greater, i out = 10 ma, v en = v in , c out = 1 f (unless otherwise noted); typical values are at t j = 25 c v out = 1.8 v figure 7. ground pin current vs load v out = 1.8 v figure 8. ground pin current vs temperature v out = 1.8 v figure 9. shutdown current vs input voltage v out = 1.8 v figure 10. current limit vs input voltage v in ? v out = 0.5 v figure 11. power-supply ripple rejection vs frequency v out = 1.8 v figure 12. power-supply ripple rejection vs input voltage 100 9080 70 60 50 40 30 20 10 0 psrr (db) 10 100 1 k 10 k 100 k 1 m 10 m frequency (hz) i = 10 ma out i = 150 ma out 2.5 2 1.5 1 0.5 0 i (ma) shdn 2.1 2.6 3.1 3.6 4.1 4.6 5.1 v (v) in 5.6 +125c+85c +25c -40c 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 input voltage (v) 8070 60 50 40 30 20 10 0 psrr (db) 1 khz 10 khz 100 khz 5045 40 35 30 25 20 15 10 50 i (ma) gnd -40 -25 -10 5 20 35 50 65 80 95 110 temperature (c) 125 450400 350 300 250 200 150 100 50 0 i (ma) gnd 0 i (ma) out 300 +125c+85c +25c -40c 50 150 250 100 200 700600 500 400 300 200 100 0 i (ma) lim 2.3 2.7 3.1 3.5 3.9 4.3 4.7 v (v) in 5.5 5.1 +125c+85c +25c -40c
8 tlv703 sbvs305 ? march 2017 www.ti.com product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated typical characteristics (continued) over operating temperature range (t j = ? 40 c to +125 c), v in = v out(nom) + 0.5 v or 2 v, whichever is greater, i out = 10 ma, v en = v in , c out = 1 f (unless otherwise noted); typical values are at t j = 25 c v out = 1.8 v, i out = 10 ma, c in = c out = 1 f figure 13. output spectral noise density vs frequency v out = 1.8 v figure 14. load transient response v out = 1.8 v, t r = t f = 1 s figure 15. load transient response v out = 1.8 v, t r = t f = 1 s figure 16. load transient response v out = 1.8 v, t r = t f = 1 s figure 17. load transient response v out = 1.8 v, i out = 300 ma, slew rate = 1 v/ s figure 18. line transient response 50 ma/div 20 mv/div 10 ms/div v out i out 50 ma 0 ma 1 v/div 5 mv/div 1 ms/div v out v in 2.9 v 2.3 v 20 ma/div 5 mv/div 10 ms/div v out i out 10 ma 0 ma 200 ma/div 100 mv/div 10 s/div m v out 300 ma 0 ma i out 100 ma/div 50 mv/div 10 ms/div v out i out 200 ma 0 ma 10 1 0.1 0.01 0.001 output spectral noise density (mv/? )hz 10 100 1 k 10 k 100 k 1 m 10 m frequency (hz)
9 tlv703 www.ti.com sbvs305 ? march 2017 product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated typical characteristics (continued) over operating temperature range (t j = ? 40 c to +125 c), v in = v out(nom) + 0.5 v or 2 v, whichever is greater, i out = 10 ma, v en = v in , c out = 1 f (unless otherwise noted); typical values are at t j = 25 c v out = 1.8 v, i out = 1 ma, slew rate = 1 v/ s figure 19. line transient response v out = 1.8 v, i out = 300 ma, slew rate = 1 v/ s figure 20. line transient response v out = 1.8 v, i out = 1 ma figure 21. v in ramp up, ramp down response 1 v/div 5 mv/div 1 ms/div v out v in 2.9 v 2.3 v 1 v/div 10 mv/div 1 ms/div 5.5 v v in 2.1 v v out 1 v/div 200 ms/div v out v in v = 1.8 v out i 1 ma out =
10 tlv703 sbvs305 ? march 2017 www.ti.com product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated 7 detailed description 7.1 overview the tlv703 series of low-dropout (ldo) linear regulators are low quiescent current devices with excellent line and load transient performance. these ldos are designed for power-sensitive applications. a precision band- gap and error amplifier provides overall 2% accuracy. low output noise, very high power-supply rejection ratio (psrr), and low dropout voltage make this series of devices ideal for most battery-operated handheld equipment. all device versions have integrated thermal shutdown, current limit, and undervoltage lockout (uvlo). 7.2 functional block diagram 7.3 feature description 7.3.1 internal current limit the tlv703 internal current limit helps protect the regulator during fault conditions. during current limit, the output sources a fixed amount of current that is largely independent of the output voltage. in such a case, the output voltage is not regulated, and is v out = i cl r load . the pmos pass transistor dissipates (v in ? v out ) i cl until thermal shutdown is triggered and the device turns off. as the device cools, the internal thermal shutdown circuit turns the device back on. if the fault condition continues, the device cycles between current limit and thermal shutdown; see the thermal consideration section for more details. the pmos pass element in the tlv703 has a built-in body diode that conducts current when the voltage at out exceeds the voltage at in. this current is not limited, so if extended reverse voltage operation is anticipated, external limiting to 5% of the rated output current is recommended. 7.3.2 shutdown the enable pin (en) is active high. the device is enabled when voltage at the en pin goes above 0.9 v. the device is turned off when the en pin is held at less than 0.4 v. when shutdown capability is not required, en can be connected to the in pin. + bandgap thermal shutdown uvlo logic current limit in en gnd out r 1 r 2 copyright ? 2017, texas instruments incorporated
11 tlv703 www.ti.com sbvs305 ? march 2017 product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated feature description (continued) 7.3.3 dropout voltage the tlv703 uses a pmos pass transistor to achieve low dropout. when (v in ? v out ) is less than the dropout voltage (v do ), the pmos pass device is in the linear (triode) region of operation and the input-to-output resistance is the r ds(on) of the pmos pass element. v do scales approximately with output current because the pmos device functions as a resistor in dropout. as with any linear regulator, psrr and transient response are degraded when (v in ? v out ) approaches dropout. figure 12 illustrates this effect. 7.3.4 undervoltage lockout (uvlo) the tlv703 uses a uvlo circuit to keep the output shut off until internal circuitry is operating properly. 7.4 device functional modes 7.4.1 normal operation the device regulates to the nominal output voltage under the following conditions: ? the input voltage is greater than the nominal output voltage added to the dropout voltage ? the output current is less than the current limit ? the input voltage is greater than the uvlo voltage 7.4.2 dropout operation if the input voltage is lower than the nominal output voltage plus the specified dropout voltage, but all other conditions are met for normal operation, the device operates in dropout mode. in this condition, the output voltage is the same as the input voltage minus the dropout voltage. the transient performance of the device is significantly degraded because the pass device is in a triode state and no longer regulates the output voltage of the ldo. line or load transients in dropout can result in large output voltage deviations. table 1 lists the conditions that lead to the different modes of operation. table 1. device functional mode comparison operating mode parameter v in i out normal mode v in > v out (nom) + v do i out < i cl dropout mode v in < v out (nom) + v do i out < i cl current limit v in > uvlo i out > i cl
12 tlv703 sbvs305 ? march 2017 www.ti.com product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated 8 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 8.1 application information the tlv703 belongs to a family of next-generation value ldo regulators. these devices consume low quiescent current and deliver excellent line and load transient performance. these characteristics, combined with low noise and very good psrr with little (v in ? v out ) headroom, make this family of devices ideal for portable rf applications. this family of regulators offers current limit and thermal protection, and is specified from ? 40 c to +125 c. 8.2 typical application figure 22. typical application circuit 8.2.1 design requirements table 2 lists the design parameters. table 2. design parameters parameter design requirement input voltage 2.5 v to 3.3 v output voltage 1.8 v output current 100 ma 8.2.2 detailed design procedure 8.2.2.1 input and output capacitor requirements 1- f x5r- and x7r-type ceramic capacitors are recommended because these capacitors have minimal variation in value and equivalent series resistance (esr) over temperature. however, the tlv703 is designed to be stable with an effective capacitance of 0.1 f or larger at the output. thus, the device is stable with capacitors of other dielectric types as well, as long as the effective capacitance under operating bias voltage and temperature is greater than 0.1 f. in addition to allowing the use of lower-cost dielectrics, this capability of being stable with 0.1- f effective capacitance also enables the use of smaller footprint capacitors that have higher derating in size- and space-constrained applications. using a 0.1- f rated capacitor at the output of the ldo does not ensure stability because the effective capacitance under the specified operating conditions must not be less than 0.1 f. maximum esr must be less than 200 m . tlv703 in en out gnd c out c in on off
13 tlv703 www.ti.com sbvs305 ? march 2017 product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated although an input capacitor is not required for stability, good analog design practice is to connect a 0.1- f to 1- f, low esr capacitor across the in pin and gnd pin of the regulator. this capacitor counteracts reactive input sources and improves transient response, noise rejection, and ripple rejection. a higher-value capacitor may be necessary if large, fast rise-time load transients are anticipated, or if the device is not located close to the power source. if source impedance is more than 2 , a 0.1- f input capacitor may be necessary to ensure stability. 8.2.2.2 transient response as with any regulator, increasing the size of the output capacitor reduces overshoot and undershoot magnitude but increases the duration of the transient response. 8.2.3 application curves v out = 1.8 v, t r = t f = 1 s figure 23. load transient response v out = 1.8 v, i out = 1 ma, slew rate = 1 v/ s figure 24. line transient response 9 power supply recommendations connect a low output impedance power supply directly to the in pin of the tlv703. inductive impedances between the input supply and the in pin can create significant voltage excursions at the in pin during start-up or load transient events. 9.1 power dissipation the ability to remove heat from the die is different for each package type, presenting different considerations in the printed-circuit-board (pcb) layout. the pcb area around the device that is free of other components moves the heat from the device to the ambient air; see the thermal information section for thermal performance on the tlv703 evaluation module (evm). the evm is a two-layer board with two ounces of copper per side. power dissipation depends on input voltage and load conditions. equation 1 shows that power dissipation (p d ) is equal to the product of the output current and the voltage drop across the output pass element. (1) 1 v/div 5 mv/div 1 ms/div v out v in 2.9 v 2.3 v p = (v v ) i - d in out out 50 ma/div 20 mv/div 10 ms/div v out i out 50 ma 0 ma
14 tlv703 sbvs305 ? march 2017 www.ti.com product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated 10 layout 10.1 layout guidelines place input and output capacitors as close to the device pins as possible. to improve ac performance (such as psrr, output noise, and transient response), ti recommends designing the board with separate ground planes for v in and v out with the ground plane connected only at the gnd pin of the device. in addition, connect the ground connection for the output capacitor directly to the gnd pin of the device. high esr capacitors can degrade psrr performance. 10.2 layout example figure 25. example layout 10.3 thermal consideration thermal protection disables the output when the junction temperature rises to approximately 165 c, allowing the device to cool. when the junction temperature cools to approximately 145 c, the output circuitry is again enabled. depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit can cycle on and off. this cycling limits the dissipation of the regulator, thus protecting the regulator from damage resulting from overheating. any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. for reliable operation, limit junction temperature to 125 c maximum. to estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. the internal protection circuitry of the tlv703 is designed to protect against overload conditions. this circuitry is not intended to replace proper heatsinking. continuously running the tlv703 into thermal shutdown degrades device reliability. c out v out v in gnd plane c in represents via used for application specific connections in gnd en nc out
15 tlv703 www.ti.com sbvs305 ? march 2017 product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated (1) for the most current package and ordering information see the package option addendum at the end of this document, or visit the device product folder at www.ti.com . (2) output voltages from 1.2 v to 4.8 v in 50-mv increments are available. contact factory for details and availability. 11 device and documentation support 11.1 device support 11.1.1 development support 11.1.2 device nomenclature table 3. ordering information (1) product v out (2) tlv703 xx yyyz xx is nominal output voltage (for example, 28 = 2.8 v). yyy is the package designator. z is tape and reel quantity (r = 3000). 11.2 documentation support 11.2.1 related documentation for related documentation see the following: using the tlv700xxevm-503 evaluation module 11.3 receiving notification of documentation updates to receive notification of documentation updates, navigate to the device product folder on ti.com. in the upper right corner, click on alert me to register and receive a weekly digest of any product information that has changed. for change details, review the revision history included in any revised document. 11.4 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 11.5 trademarks e2e is a trademark of texas instruments. bluetooth is a registered trademark of bluetooth sig. zigbee is a registered trademark of the zigbee alliance. all other trademarks are the property of their respective owners. 11.6 electrostatic discharge caution this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.7 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions.
16 tlv703 sbvs305 ? march 2017 www.ti.com product folder links: tlv703 submit documentation feedback copyright ? 2017, texas instruments incorporated 12 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation.
package option addendum www.ti.com 30-sep-2017 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples tlv70310dbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 1f4q tlv70311dbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 1f1q tlv70312dbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 1ecq tlv70313dbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 1g5q tlv70315dbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 1edq tlv70318dbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 1aze tlv70325dbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 1eeq TLV70327DBVR active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 1exq tlv70328dbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 1b3e tlv70329dbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 1ezq tlv70333dbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 1ahq (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.
package option addendum www.ti.com 30-sep-2017 addendum-page 2 (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant tlv70310dbvr sot-23 dbv 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 q3 tlv70311dbvr sot-23 dbv 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 q3 tlv70312dbvr sot-23 dbv 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 q3 tlv70313dbvr sot-23 dbv 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 q3 tlv70315dbvr sot-23 dbv 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 q3 tlv70318dbvr sot-23 dbv 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 q3 tlv70325dbvr sot-23 dbv 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 q3 TLV70327DBVR sot-23 dbv 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 q3 tlv70328dbvr sot-23 dbv 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 q3 tlv70329dbvr sot-23 dbv 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 q3 tlv70333dbvr sot-23 dbv 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 q3 package materials information www.ti.com 15-sep-2017 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) tlv70310dbvr sot-23 dbv 5 3000 180.0 180.0 18.0 tlv70311dbvr sot-23 dbv 5 3000 180.0 180.0 18.0 tlv70312dbvr sot-23 dbv 5 3000 180.0 180.0 18.0 tlv70313dbvr sot-23 dbv 5 3000 180.0 180.0 18.0 tlv70315dbvr sot-23 dbv 5 3000 180.0 180.0 18.0 tlv70318dbvr sot-23 dbv 5 3000 180.0 180.0 18.0 tlv70325dbvr sot-23 dbv 5 3000 180.0 180.0 18.0 TLV70327DBVR sot-23 dbv 5 3000 180.0 180.0 18.0 tlv70328dbvr sot-23 dbv 5 3000 180.0 180.0 18.0 tlv70329dbvr sot-23 dbv 5 3000 180.0 180.0 18.0 tlv70333dbvr sot-23 dbv 5 3000 180.0 180.0 18.0 package materials information www.ti.com 15-sep-2017 pack materials-page 2

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